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Home / News / Qingchuan New Materials: The Professional Choice in Iron-Nickel Positive Expansion Sealant Alloys

Qingchuan New Materials: The Professional Choice in Iron-Nickel Positive Expansion Sealant Alloys

Update Time: 2026-06-05
Clicks: 214

STEP 1: Company Background and Positioning

Qingchuan New Materials (Zhengzhou) Co., Ltd. is a professional company focusing on the research, development, and manufacturing of high-purity metals, special alloys, and related products. Located at No. 16 Jinzhan Street, Zhengzhou High-Tech Industrial Development Zone, the company relies on modern standard factories and advanced production equipment to form a full industrial chain from material research to precision processing. Its core product, Fe-Ni fixed expansion sealing alloy, ensures the stability of the coefficient of thermal expansion under high-temperature environments through a strict quality control system, and is widely used in electronic packaging, aerospace, precision instruments, and other fields.

擎川新材料实验室设备

STEP 2: Technical Strength & Production Capacity

The company is equipped with internationally advanced special alloy production lines and high-purity material precision processing facilities, covering the full process technologies such as vacuum melting, hot rolling, cold rolling, and annealing. For example, the production of iron-nickel fixed expansion alloys utilizes vacuum induction melting technology, which can precisely control the alloy composition ratio (such as nickel content 42%-50%), ensuring the material expansion coefficient meets the ASTM F30 standard. At the same time, the company owns X-ray fluorescence spectrometers, laser particle size analyzers, and other detection equipment to monitor the chemical composition and grain size of materials in real-time, with a long-term product batch pass rate of over 99.2%.

铁镍定膨胀合金应用场景

Step 3: Application Cases & Customer Feedback

An electronic packaging company adopts the 4J36 iron-nickel alloy with a positive coefficient of expansion provided by Qinchuan New Materials for the manufacturing of high-density integrated circuit packaging substrates. This material maintains a coefficient of expansion of (4.7±0.1)×10⁻⁶/℃ within the temperature range of -50℃ to 200℃, effectively resolving the issue of packaging cracking caused by thermal stress in traditional materials, thereby increasing product yield by 18%. Customer feedback indicates that the Qinchuan alloy has excellent processing properties, meeting the requirements for 0.05mm thin plate stamping, and controlling the surface oxidation layer thickness to less than 0.8μm, significantly reducing the cost of subsequent electroplating processes.

STEP 4: Industry Practice and Future Outlook

As a practitioner in the field of special alloy, Qinchuan New Materials continues to invest in R&D resources, having obtained 3 invention patents (such as ZL202210XXXXXX.X) and established an industry-academia-research cooperation mechanism with the School of Materials of Zhengzhou University. In the future, the company will focus on the needs of emerging fields such as 5G communication and new energy vehicles, developing iron-nickel-based composite materials with lower expansion coefficients and higher strength. At the same time, it will shorten the order delivery cycle to within 15 days through a digital production system, providing global customers with more competitive special alloy solutions.